BLM21xN1 Series Datasheet

Murata Electronics North America

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Datasheet

Spec. No. JENF243A-0005Y-01 P.1/11
MURATA MFG.CO., LTD.
Reference Only
Chip Ferrite Bead BLM21□□□□□□N1 Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM21_N Series.
2. Part Numbering
(ex.) BL M 21 AG 121 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
3. Rating
(1)Product ID (7)Category
(2)Type (8)Numbers of Circuit
(3)Dimension (L×) (9)Packaging
(4)Characteristics D:Taping(φ180mm Reel, Paper Tape)
L:Taping(φ180mm Reel, Plastic Tape)
B:Bulk
(5)Typical Impedance at 100MHz
(6)Performance
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition)
Rated Current
(mA)(
1)
DC Resistance
(Ω) max.
Remark
Initial
Values
Values
After
Testing
Typical at
85°C
at
125°
C
BLM21PG220SN1D
22±25 22 *1
6000
*1
3300 0.009 0.018
For DC
power line
BLM21PG220SN1B
BLM21PG300SN1D
20 min. 30 *1
4000
*1
2300 0.014 0.028
BLM21PG300SN1B
BLM21PG600SN1D
60±25 60 *1
3500
*1
1900 0.02 0.04
BLM21PG600SN1B
BLM21PG121SN1D
120±25 120 *1
3000
*1
1550 0.03 0.06
BLM21PG121SN1B
BLM21PG221SN1D
220±25 220 *1
2000
*1
1250 0.045 0.09
BLM21PG221SN1B
BLM21PG331SN1D
330±25 330 *1
1500
*1
1000 0.07 0.14
BLM21PG331SN1B
BLM21SN300SN1D
30±10 30
*1
8500
*1
6000 0.004 0.005
BLM21SN300SN1B
BLM21SP700SN1D 70±25% 70
*1
6000
*1
4000 0.009 0.012
BLM21SP700SN1B
BLM21SP111SN1D 110±25% 110
*1
5000
*1
3300 0.013 0.016
BLM21SP111SN1B
BLM21SP181SN1D 180±25% 180
*1
4000
*1
2600 0.020 0.025
BLM21SP181SN1B
BLM21RK121SN1D 120±25% 120 200 0.15 0.25
For
Digital
Interface
BLM21RK121SN1B
BLM21RK221SN1D 220±25% 220 200 0.20 0.30
BLM21RK221SN1B
BLM21RK471SN1D 470±25% 470 200 0.25 0.35
BLM21RK471SN1B
BLM21RK601SN1D 600±25% 600 200 0.30 0.40
BLM21RK601SN1B
BLM21RK102SN1D 1000±25% 1000 200 0.50 0.60
BLM21RK102SN1B
Total page 2/16
Spec. No. JENF243A-0005Y-01 P.2/11
MURATA MFG.CO., LTD.
Reference Only
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition) Rated Current
(mA)
DC Resistance
(Ω) max.
Remark
Initial
Values
Values
After
Testing
Typical
BLM21BB050SN1D
5±25 5 1000 0.02 0.04
For
high speed
signal line
BLM21BB050SN1B
BLM21BB600SN1D
60±25 60 800 0.13 0.23
BLM21BB600SN1B
BLM21BB750SN1D
75±25 75 700 0.16 0.26
BLM21BB750SN1B
BLM21BB121SN1D
120±25 120 600 0.19 0.29
BLM21BB121SN1B
BLM21BD121SN1D
120±25 120 350 0.25 0.35
BLM21BD121SN1B
BLM21BB151SZ1D 150±25 150 600 0.21 0.31
BLM21BB151SZ1B
BLM21BD151SN1D 150±25 150 350 0.25 0.35
BLM21BD151SN1B
BLM21BB201SN1D
200±25 200 500 0.26 0.36
BLM21BB201SN1B
BLM21BB221SN1D
220±25 220 500 0.26 0.36
BLM21BB221SN1B
BLM21BD221SN1D
220±25% 220 350 0.25 0.35
BLM21BD221SN1B
BLM21BB331SN1D
330±25 330 400 0.33 0.43
BLM21BB331SN1B
BLM21BD331SN1D
330±25% 330 300 0.3 0.4
BLM21BD331SN1B
BLM21BD421SN1D
420±25% 420 300 0.3 0.4
BLM21BD421SN1B
BLM21BB471SN1D
470±25 470 400 0.40 0.50
BLM21BB471SN1B
BLM21BD471SN1D
470±25% 470 300 0.35 0.45
BLM21BD471SN1B
BLM21BD601SN1D
600±25% 600 300 0.35 0.45
BLM21BD601SN1B
BLM21BD751SN1D
750±25% 750 250 0.4 0.5
BLM21BD751SN1B
BLM21BD102SN1D
1000±25% 1000 250 0.4 0.5
BLM21BD102SN1B
BLM21BD152SN1D
1500±25% 1500 250 0.45 0.55
BLM21BD152SN1B
BLM21BD182SN1D
1800±25% 1800 250 0.5 0.6
BLM21BD182SN1B
BLM21BD222SN1L
1600 min. 2250 250 0.6 0.7
BLM21BD222SN1B
BLM21BD222TN1D
2200±25% 2200 200 0.6 0.7
BLM21BD222TN1B
BLM21BD272SN1L
2700±25% 2700 200 0.8 0.9
BLM21BD272SN1B
Total page 3/16
Spec. No. JENF243A-0005Y-01 P.3/11
MURATA MFG.CO., LTD.
Reference Only
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(at 100MHz,Under Standard
Testing Condition) Rated Current
(mA)
DC Resistance
(Ω) max.
Remark
Initial
Values
Values
After
Testing
Typical
BLM21AG121SN1D
120±25 120 1000 0.09 0.19
For
general
use
BLM21AG121SN1B
BLM21AG151SN1D
150±25 150 1000 0.09 0.19
BLM21AG151SN1B
BLM21AG221SN1D
220±25 220 900 0.12 0.22
BLM21AG221SN1B
BLM21AG331SN1D
330±25 330 800 0.15 0.25
BLM21AG331SN1B
BLM21AG471SN1D
470±25 470 700 0.18 0.28
BLM21AG471SN1B
BLM21AG601SN1D
600±25 600 700 0.2 0.3
BLM21AG601SN1B
BLM21AG102SN1D
1000±25 1000 600 0.27 0.37
BLM21AG102SN1B
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(Note)As for Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
4. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.010g
0.014g ( for 21BD222SN1/21BD272SN1
)
L W T E
2.0±0.2 1.25±0.2
0.85±0.2 0.5±0.2
for 21BD222SN1
21BD272SN1
1.25±0.2
for 21BD272SN1
0.3±0.2
(in mm)
5. Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
:Electrode
LW
E
T
Resistance element becomes
dominant at high frequencies.
()
Operating Temperature (°C)
x
1
85 125
0
Rated Current (A)
Describe the Rated current as x[A]
in case of more than 1A.
85℃
125℃
Total page 3/16
Spec. No. JENF243A-0005Y-01 P.4/11
MURATA MFG.CO., LTD.
Reference Only
7. Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment :
KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3.
Measuring Equipment : Digital multi mete
r
* Except resistance of the Substrate and Wire
7-2. Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5s±1s
Applied direction:Parallel to substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×1.6mm
Deflection: 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2-4 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Meet Table 2.
Table 2
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM21SN
Within ±50%)
DC
Resistance Meet item 3.
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-6 Drop Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
7-2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 4s±1s
Immersion and emersion rates : 25mm/s
45mm
R340
F
Deflection
45mm Product
Pressure jig
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance Meet item 3.
R0.5
Substrate
Side view
Spec. No. JENF243A-0005Y-01 P.5/11
MURATA MFG.CO., LTD.
Reference Only
7-3. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
Meet Table 2.
1 cycle :1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-3 Heat Life Temperature : 125°C±3°C
(in case of Rated current is more than 1A,
do the test at : +85 °C±3°C)
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-4 Cold
Resistance
Temperature : -55°C±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8. Specification of Packaging
8-1. Appearance and Dimensions
Part Number Type Appearance and Dimensions
a
*Dimension of the Cavity is measured at the bottom side.
BLM21
except
21BD222SN1L
21BD272SN1L
8mm-
wide
Paper
tape
1.1
max.
BLM21BD222SN1L
BLM21BD272SN1L
8mm-
wide
Plastic
tape
1.3
±0.1
(in mm)
Paper tape Plastic tape
Taping Products shall be packaged in the cavity of the base
tape of 8mm-wide, 4mm-pitch continuously and
sealed by top tape and bottom tape.
Products shall be packaged in the each embossed
cavity of 8mm-wide, 4mm-pitch plastic tape
continuously and sealed by cover tape.
Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user.
Spliced point The base tape and top tape have no spliced point. The cover tape has no spliced point.
Cavity There shall not be burr in the cavity.
Missing
components
number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
0.2±0.1
a
Paper Tape
φ
1.5
a
Direction of feed
4.0±0.1 4.0±0.1
2.25±0.1
2.0±0.05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.45±0.1
Plastic Tape
There are holes in the cavity
of the Plastic tape
φ
1.0
+0.3
-0
Total page 6/16
Spec. No. JENF243A-0005Y-01 P.6/11
MURATA MFG.CO., LTD.
Reference Only
8-2. Tape Strength
(1)Pull Strength
Paper tape Top tape
5N min.
Bottom tape
Plastic tape Plastic tape
5N min.
Cover tape
10N min.
(2) Peeling off force of Top tapeCover tape
Speed of Peeling off 300mm/min
Peeling off force *Paper tape 0.1N to 0.6N
Plastic tape 0.2N to 0.7N
* Minimum value is typical.
Case of Paper tape Case of Plastic tape
8-3. Taping Condition
(1) Standard quantity per reel
Type Quantity per 180mm reel
BLM21(except 21BD222SN1L/21BD272SN1L) 4000 pcs. / reel
BLM21BD222SN1L/BLM21BD272SN1L 3000 pcs. / reel
(2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc)
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
Top tape
Bottom tape Base tape
165 to 180 degree FCover tape
Plastic tape
165 to 180 degree F
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
+1
-0
Cover tape
・・・
Plastic tape
Top tape
・・・
Paper tape
Label
Spec. No. JENF243A-0005Y-01 P.7/11
MURATA MFG.CO., LTD.
Reference Only
8-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an
order.
9. Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment (6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Transportation equipment (trains,ships,etc.)
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions
< BLM21 series(except BLM21PG/BLM21S type) >
(in mm)
< For BLM21PG/BLM21S type >
Type
Rated
Current
(A)
Land pad thickness
and dimension a
18µm 35µm 70µm
BLM21PG
1.5 1.0 1.0 1.0
2 1.2 1.0 1.0
34 2.4 1.2 1.0
6 6.4 3.3 1.65
BLM21S 68.5 - 6.8 3.4
(in mm)
*The excessive heat by land pads may cause deterioration
at joint of products with substrate.
1.2
3.0 to 4.0
Chip Ferrite Bead
Solder Resist
Pattern
1.0
1.2
3.0to4.0
Chip Ferrite Bead
Solder Resist
Pattern
a
1.0
Total page 8/16
W
D
Label
H
Spec. No. JENF243A-0005Y-01 P.8/11
MURATA MFG.CO., LTD.
Reference Only
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solde
r
Use Sn-3.0Ag-0.5Cu solde
r
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) soldering profile
Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、46s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230℃
260
245℃±3
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
265℃±3
Spec. No. JENF243A-0005Y-01 P.9/11
MURATA MFG.CO., LTD.
Reference Only
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
1/3TtT
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Total page
Perforation
Slit
A
B
C
D
Spec. No. JENF243A-0005Y-01 P.10/11
MURATA MFG.CO., LTD.
Reference Only
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Screw Hole Recommended
Spec. No. JENF243A-0005Y-01 P.11/11
MURATA MFG.CO., LTD.
Reference Only
10-11 Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.

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Unit Price0.1
FERRITE BEAD 120 OHM 0805 1LN
Available Quantity55615
Unit Price0.1
FERRITE BEAD 120 OHM 0805 1LN
Available Quantity74430
Unit Price0.13
FERRITE BEAD 600 OHM 0805 1LN
Available Quantity1264097
Unit Price0.13
FERRITE BEAD 120 OHM 0805 1LN
Available Quantity42029
Unit Price0.13
FERRITE BEAD 600 OHM 0805 1LN
Available Quantity63798
Unit Price0.14
FERRITE BEAD 1 KOHM 0805 1LN
Available Quantity2252229
Unit Price0.15
FERRITE BEAD 1 KOHM 0805 1LN
Available Quantity68930
Unit Price0.15
FERRITE BEAD 2.7 KOHM 0805 1LN
Available Quantity46774
Unit Price0.17
FERRITE BEAD 1.5 KOHM 0805 1LN
Available Quantity33117
Unit Price0.17
FERRITE BEAD 150 OHM 0805 1LN
Available Quantity467122
Unit Price0.13
FERRITE BEAD 470 OHM 0805 1LN
Available Quantity28364
Unit Price0.13
FERRITE BEAD 470 OHM 0805 1LN
Available Quantity16143
Unit Price0.13
FERRITE BEAD 330 OHM 0805 1LN
Available Quantity7522
Unit Price0.13
FERRITE BEAD 330 OHM 0805 1LN
Available Quantity10498
Unit Price0.13
FERRITE BEAD 120 OHM 0805 1LN
Available Quantity7725
Unit Price0.13