2538 and 2538UV High-Temperature Masking Liquid

3M's high-temperature masking liquid 2538 and 2538UV is an olefin hybrid adhesive that is specially formulated to offer excellent high-temperature resistance and low slump during processing. The high-temperatures masking liquid is an efficient alternative to conventional printed circuit board masking techniques. This specially formulated hot melt removes cleanly from various electronic substrates by peeling even after 10 minutes at +260°C (+500°F). The non-silicone formulation reduces the potential for silicone contamination which can interfere with subsequent bonding or conformal coating processes. The high-temperature resistance adhesive also possesses excellent chemical resistance and can be considered for demanding chemical masking applications. The 2538UV allows users to pull off the adhesive under UV lighting (blacklight illumination is only applicable for 2538UV) making visual inspection easier when removing masking materials.